ブックタイトル佐藤真空真空装置2017

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佐藤真空真空装置2017

真空ガス置換乾燥装置Vacuum Gas Substitution Drying OvenFeatures■Dramatic reductions in gas volumes and time required for substitutionThe powerful vacuum exhaust facilitates efficient gas substitution, reducing the amount of gasand time required for the process than gas-flow method.■Simple oxygen density and process controlThe air inside the chamber is exhausted by the vacuum pump with a specified exhaust capacity.Oxygen density can be controlled by the number of times gas substitution is repeated. Sincethe overall time required for substitution is set at the same time, total process control can beperformed reliably and easily.■The equipment is configured using a vacuum chamber and components and is thereforeunaffected by the external atmosphere.Since the equipment was designed and manufactured to achieve a structure, strength and otherparameters equivalent to those used for vacuum chambers, overall system leakage is extremelysmall (leak rates: x10 -6 Pa・L/sec or less). This allows clean heat treatment in low-oxygenatmospheres unaffected by external atmospheres, even during vacuum exhaust operations.■Two types of heat treatment can be performed by a single device?in a vacuum or in a gasatmosphere.This equipment is also capable of performing vacuum drying and vacuum baking at levels thatmeet our standard vacuum specification.■Forced cooling function (option) for further reductions in processing timeThe incorporation of the optional forced cooling function dramatically reduces the time requiredfor the chamber to cool to a temperature at which workpieces can be removed, thereby reducingoverall processing times.Functions■Heating mechanismThe sheath heaters incorporated into the four chamber walls are used as heating sources, andthe fan installed on the rear wall performs gas circulation heating. PID control can be selectedas fixed PID control, in which heating temperatures are specified and temperatures raised until itreaches that level, or as PID control using the heating patterns from a programmable controller.■CoolingThe following three methods are used to reduce processing temperatures to levels at whichthe workpieces can be removed:1.Gas-substitution cooling 2.Gas-flow cooling 3.Forced-gas-circulation cooling (optional)The cooling method is determined by factors such as workpiece material properties and shapeand by the processing time required.■Vacuum exhaustAn oil-sealed rotary vacuum pump is used to perform exhaust, and the ultimate pressure withinthe chamber is x10 1 Pa. The standalone pump exhaust system creates a powerful vacuum,and gas containing oxygen within the chamber is exhausted forcefully.■Operation start/stopAutomatic operation start: Manual or timer start/Stop: Depends on sequencer program■Safety/Product maintenanceIf equipment malfunctions are detected during automatic operations, the system eithersuspends all operations or specific functions, depending on the type of malfunction (a drop incooling water amount or air pressure, overheating, and so forth). The system displays detailedinformation on the malfunction.ApplicationsThis equipment is primarily used for clean drying and baking of a wide range of products inlow oxygen atmospheres. These products include semiconductor components, electricaland electronic components, electronic materials, metals, ceramics, and new materials. Theequipment configuration also allows use for vacuum drying and vacuum baking.22